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Dr Andy Mackie, Indium’s global product manager of semiconductor and advanced assembly materials, will discuss package-on-package (PoP) processes at the SMTA Intermountain Expo and Technical Forum.

In his presentation, entitled ‘Theoretical and Practical Considerations for Optimizing PoP Assembly’, Mackie will discuss both the theoretical and practical considerations of the materials and processes used in PoP and give assembly engineers tools for optimisation.

Mackie specialises in new product and process development and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly and semiconductor packaging.

Indium, a supplier of materials to the electronics, semiconductor, solar, thin-film and thermal management markets, will exhibit products such as solders, preforms and fluxes, brazes, sputter targets, indium, gallium and germanium chemicals and sourcing and Reactive Nanofoil at the event, which will be held on 22 March 2011 at Boise State University.

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