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Aries Electronics is offering a Kelvin test socket that handles devices with a lead pitch down to 0.4mm.

The socket uses two independent Aries Kelvin spring probes per device pad for reliable, low-resistance testing of MLF, QFN, LGA and other leadless devices.

With a signal path of only 0.082in, Aries’ Kelvin test socket is said to provide minimal signal loss for higher bandwidth capability.

The socket’s low-cost, two-piece construction and small overall size allows the maximum number of sockets per test board.

The operator-friendly, low-profile socket uses solderless pressure mount compression spring probes, accurately located by two moulded plastic alignment pins and mounted with four stainless-steel screws, allowing for easy mounting and removal from the test board.

For increased reliability, the gold-over-nickel-plated probes leave small witness marks on the bottom of the device pads.

The probes are constructed of heat-treated beryllium-copper with a minimum of 50 micron inches (1.27 micron mm) gold per Mil-G-45204 over 50 micron (1.27 micron mm) nickel per SAE-AMS-QQ-N-290.

The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness.

A probe blade edge tip ensures cutting through solder oxides layers for use in applications with RoHS-coated or gold pads.

Contact forces are 16G per contact on a 0.40mm to 0.45mm pitch.

The probe can operate in temperatures from -55C to 150C and contact life is an estimated minimum of 500,000 cycles.

The machined socket components are UL 94V-0 Peek or Torlon, screws and alignment pins are stainless steel, and moulded socket components are UL 94V-0 Ultem.

The Kelvin test socket contact system is available for any Aries CSP test socket.

As with all Aries sockets, the Kelvin test socket is available in custom materials, platings, sizes and configurations to suit specific applications.

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