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Lord has announced the availability of Lord SC-305, a thermally conductive silicone encapsulant designed for encapsulation applications where high heat dissipation is required.

Lord SC-305 is a two-component silicone system that is suitable for LED lighting power supply encapsulation.

It can be room temperature or heat cured for maximum adhesion.

Benefits of the encapsulant include low stress, high thermal conductivity and good environmental resistance, according to Lord.

The silicone encapsulant is composed of an addition-curing polymer that will not depolymerise when heated in confined spaces.

This makes it a durable solution that also meets the requirements of UL 94 V-O, providing good flame retardancy.

In addition, the three-step application process involving mixing, applying and curing is user-friendly, making Lord SC-305 well suited for encapsulation.

Adam Conklin, global market manager at Lord, said Lord SC-305 was developed to meet the needs of customers requiring a high-performance thermally conductive encapsulant at a cost that allows them to be competitive in their respective industries.

He claimed that it enables electronic-component manufacturers to address the continued pressure to reduced costs without sacrificing performance.

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