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LSI Corporation has announced its next-generation link layer processor (LLP), a new addition to the company’s family of multi-service processors.

A single line card design, the LLP system-on-chip (SoC) supports all major protocols and is scalable across the bandwidth spectrum from T1/E1 to STM-1, meaning that a single OEM development effort can now be leveraged across all major services and performance levels.

Until now, telecom OEMs had to purchase and integrate individual cards for each major service type.

The LSI LLP runs on a common, highly-scalable hardware and software platform, reducing both development time and the number of cards needed to provide multiple network services.

OEMs are now able to leverage a single design effort across multiple applications such as wireless base stations, wireless transport and high-end radio network controllers.

In wireless applications, the LLP SoC supports backhaul of both BTS (2G) and Node B (3G) traffic to BSC (2G) and RNC (3G).

Similarly, the new multi-core LLP enables the transport of multiple legacy protocols across wireline packet networks.

Network uptime is maximised because the LLP continues to operate WAN modules in the event of system reboot and switches automatically to back-up capacity if a system failure occurs that would otherwise impact traffic.

The result is an efficient, available network capable of delivering multiple, any-to-any services.

The LLP SoC provides a range of multi-service support including Metro Ethernet, IP, MPLS, edge-to-edge pseudo-wire emulation (PWE3) using CESoPSN, SAToP, ATM, TC/IMA, HDLC/MLPPP, AAL1, frame relay and Transcoder Rate Adaptation Unit protocols.

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