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Lumera Laser has published a technical article to explain how picosecond lasers can be used to achieve high-quality industrial micromachining.

Laser pulses in the millisecond to nanosecond regime are now being used for drilling holes in wafers, cutting thin sheet metal, scribing ceramics and marking automotive parts, credit cards and passports.

According to Lumera, lasers outperform mechanical tools in micromachining applications due to their flexibility, reliability, reproducibility, ease of programming and lack of mechanical force or contamination to the part.

To read the rest of the technical article, click the link above this article to download the PDF.

LUMERA LASER develops / manufactures picosecond lasers for micro-processing.
LUMERA LASER pioneered this technology, and is the clear market leader in terms of market share, technology and reliability.

These ultra-short pulse lasers offer a new quality in laser micromachining by 'cold' ablation, by removal of any material.
A single laser pulse will remove in the focus spot (typically1-50µm dia.) a thin material layer (20-200nm), without thermal side-effects like burrs and micro-cracks. Up to 1 mio pulses per second can act, so that 6-60mm³/min can be ablated.
The proper overlap of the pulses (controlled by galvos) will define the structure; scribe, cut, drill, or produce a 2.5-D form into any material directly from CAD file.
The investment for such laser is in the order of 100-250k€, the TCO per min in the range of 12-20 Cent per minute only.
Industrial picosecond lasers are new universal tools for micro-processing of any material (!) without mechanical contact/force, without wear and tear and without thermal damages.
There is a wide range of applications in semicon, LED making, PV, display tech, micro tool manufacture, micro-fluidics, bio-med, automotive, aerospace, printing, etc.

LUMERA LASER runs an experienced app lab to demonstrate a solution for your application.

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