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PAandE’s non-magnetic Micro-D connector line is suitable for engineers that design electronic components for use in applications where non-magnetic characteristics are required.

These new Micro-D connectors combine a MIL-PRF-83513 compliant Micro-D interface with low magnetic-permeability characteristics and are particularly suitable for harsh environments where superior hermetic integrity and non-magnetic characteristics are crucial to a component’s design.

The connectors’ shell comprises of titanium and Inconel, as this metal combination delivers the strength, expansion co-efficients and low magnetic permeability required.

These metals are joined using PAandE’s explosive metal-welding processes.

Pin material options include Inconel, molybdenum or titanium.

Designed to be laser welded into PAandE’s titanium or titanium-composite electronic packages, these new Micro-D connectors can be manufactured in nine, 15, 21, 25, 31, 37, 51 and 100-pin configurations.

They use PAandE’s unique polycrystalline ceramic-sealing technology to deliver a leak rate of less than 1X10-9cc/sec helium at one atmospheric differential pressure.

The Micro-D line provides insulation resistance of more than 5,000 megohms at 500V DC and exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003.

They perform reliably in temperatures ranging from -65C to +260C.

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