Product Details Supplier Info More products

Schroff has introduced a new MicroTCA system designed to meet the requirements of the proposed MTCA.4 sub-specification for high-energy physics and other advanced test-and-measurement applications.

To ensure that MicroTCA is suitable for use in the future data systems of particle accelerators and similar research facilities, a new version of the specification has been developed, known as MTCA.4: MicroTCA enhancements for rear I/O and precision timing.

This MTCA.4 system, comprising compact chassis, backplane, power supply and fan, is designed to be an entry-level system for development purposes — enabling users to test the board mechanics and functionality of the rear I/Os, including integration of the new MicroRTM modules into the existing shelf management.

On the front it has six AdvancedMC slots in double mid-size format, one MicroTCA carrier hub (MCH) slot and one slot for a plug-in 300W PSU, while on the rear there are six rear transition module (RTM) slots in double mid-size format.

Key specifications

  • Chassis dimensions: 5U high, 42HP wide
  • Includes backplane, power supply and fan
  • Built-in fan (controlled via MCH) helps dissipate heat
  • Front inputs: six Advanced MC slots, one MCH slot, one plug-in 300W PSU slot
  • Rear inputs: six RTM slots

For over four decades Schroff has been a world leader in the development and manufacture of electronics packaging components and systems.

The company offers a comprehensive range of enclosure solutions, including cabinets, subracks, cases, backplanes and power supplies, as well as complete systems for standard bus architectures such as VME, cPCI, AdvancedTCA and MicroTCA.

These products are based on the know-how of specialists in the integration of mechanical, electronic and thermal management systems, together with many years’ experience of the most diverse applications in all kinds of environments. Schroff technical personnel are also heavily involved in the development of international standards for electronics packaging systems, with representatives on numerous working groups of institutions such as the IEC, CENELEC, IEEE, BSI, VDE and DIN.

To complement its wide range of products, the company has established a co-ordinated service strategy designed to ensure that customers enjoy comprehensive support throughout the life of the product.Grouped together under the banner ‘ServicePLUS’, Schroff’s product support services are now arranged in eight modules comprising configuration, assembly, modification, solution, express, support, academy and lifecycle.

The Schroff website, provides full technical information on all of the company’s products, including detailed descriptions, technical data, user manuals, test reports and downloadable CAD drawings

View full profile