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Oxford Semiconductor has introduced the OXPCIe200 PCI Express multi-port bridge.

The OXPCIe200 offers designers a range of options for PCI Express bridging that can be used together or in isolation to connect subsystems to a PCIe-based system.

Targeting the bridging, device control and IO expansion needs of industrial control, PC peripherals, Expresscard modules, point-of-sale terminals, servers, communications systems and embedded designs, the OXPCIe200 provides the bridging power required for inter-processor communication and device control in these PCIe-based systems.

It has a connectivity set comprised of a USB 2.0 host port, a port configurable as a USB 2.0 host, SPI or Sram interface and a UART port.

The single-chip device has been designed to achieve the high-level system performance required by demanding bridging applications, while at the same time offering fast, easy design-in.

This device delivers up to 62.5Mbytes/s data throughput and low CPU utilisation at a 30 to 40 per cent cost saving, while also claiming to save designers from three to six months of development time.

The OXPCIe200 delivers a choice of intermediate bridging formats that make it suitable for a diverse range of applications and with support for multiple data pipes, multi-channel DMA and MSI-X interrupts.

It also includes the addition of active state power management (ASPM), a digital (Phy-less) interface using a reverse ULPI port, PCI power management (including wake up from D3cold) and industrial temperature range.

These features make the OXPCIe200 suitable for power and temperature sensitive Expresscard and Minicard designs.

Oxford Semiconductor

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