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Peel-A-Way Removable Terminal Carriers have been introduced for device socketing and board-to-board interconnect in applications that require low-profile, customisable PCB configurations.

Compared to traditional moulded insulators, the 0.005in (0.13mm) polyimide-film carrier, employing near-flush solder-tail terminals (Type -210), reduces component height above the PC board by as much as 80 per cent, down to 0.015in (0.38mm).

For board-to-board applications, standard spacing options range from 0.045in (1.14mm) to 0.250in (6.35mm) with custom options available to suit virtually any application.

In-house carrier stamping and precision drilling enable fast turnaround on customised configurations, including prototypes.

Designs include zig zag, off pitch, special radius, circular and patterns with multiple terminal/pin styles or cutouts.

Screw-machined socket and adapter terminals include tin/lead or lead-free plating, as well as optional solder performs for mixed SMT/through-hole soldering environments.

Peel-A-Way Removable Terminal Carriers allow virtually any pattern of sockets and/or pins to be combined on a single sheet for one-time PCB loading.

The RoHS-compliant insulator is made from high-temperature polyimide film and can be left in place after soldering for added stability or removed for full solder-joint visibility, inspection and test.

Applications include socketing of relays, power devices, temperature and process-sensitive sensors and displays, as well as applications in industries including automotive, aerospace, computer and peripherals, industrial, instrumentation and test, medical, military and telecom.

Standard configurations such as DIP, SIP and PGA patterns are available with a three-day lead time.

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