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With its low loss and low dielectric constant of 1.96 at 10 GHz, Rogers’ RT/duroid 5880LZ laminates are suitable for exacting stripline and microstrip circuits, including airborne antennas.

The company will display these, along with a selection of its materials-based solutions, at the 2010 IEEE International Microwave Symposium (IMS), scheduled for 25-27 May 2010 at the Anaheim Convention Center, Anaheim, CA.

Rogers will showcase its high-performance materials, including RT/duroid 5880LZ, RT/duroid 6202PR, RO4360 laminate and Heatwave metal-matrix composites thermal-management solution.

RT/duroid 5880LZ is a PTFE-based composite with a filler for applications requiring low-density, lightweight circuit boards.

Woven-glass-reinforced RT/duroid 6202PR laminates offer mechanical and electrical stability in ground-based and airborne applications.

They exhibit tight control of dielectric constant and thickness, and dimensional stability of 0.05 to 0.07mils/in for stable planar resistors, resonators, filters and other high-frequency circuits.

The proven stability and low thermal coefficient of dielectric constant of RT/duroid 6202PR laminates makes them suitable for multilayer circuits.

For designers needing commercial grade off-the-shelf materials, Rogers RO4000 laminates are a lower-cost alternative with strong RF performance.

These glass-reinforced thermoset materials can be processed in automated assembly lines like the FR-4 and exhibit low loss with high thermal conductivity.

The RO4360 product is said to be the first high Dk RF grade thermoset material to be offered in the industry.

With a dielectric constant of 6.15 at 2.5 and 10 GHz, RO4360 laminates can be used for miniature printed antennas and other compact circuits.

Rogers’ TMS Division will feature its Heatwave aluminum silicon carbide (AlSiC) metal-matrix composite (MMC) thermal-management material.

Supplied in a range of thermal conductivities from 170 to 230W/mK, this lightweight material is suitable for thermal base plates, heat spreaders, semiconductor packaging and pin fin heat sinks.

It is available with tightly controlled coefficient of thermal expansion (CTE) from 5 to 14ppm/K, allowing users to minimise stress during thermal cycling in a range of thermal-management applications.

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