Product Details Supplier Info More products

Rutronik has introduced the XCede range of vertical backplane headers and right-angle daughter-card receptacles designed for 25Gb/sec performance.

According to the company, the XCede connector platform provides a long-term migration path for customers who are designing equipment platforms that will need to evolve to enable higher-speed signalling and higher levels of performance in the future.

Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer, with four, six or eight wafers per signal connector module.

Key features

  • Vertical header range includes options with two-, three- or four-wall connector shrouds
  • Among the three-wall options are versions with integrated guide posts and polarisation key openings
  • Advanced engineering polymers in a resonance-damping shield eliminate crosstalk resonances and enable low crosstalk across a wide frequency range

Rutronik releases vertical backplane headers and right-angle daughter-card receptacles

Rutronik has introduced the XCede range of vertical backplane headers and right-angle daughter-card receptacles designed for 25Gb/sec performance.

According to the company, the XCede connector platform provides a long-term migration path for customers who are designing equipment platforms that will need to evolve to enable higher-speed signalling and higher levels of performance in the future.

Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer, with four, six or eight wafers per signal connector module.

Key features

  • Vertical header range includes options with two-, three- or four-wall connector shrouds
  • Among the three-wall options are versions with integrated guide posts and polarisation key openings
  • Advanced engineering polymers in a resonance-damping shield eliminate crosstalk resonances and enable low crosstalk across a wide frequency range

View full profile