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Schroff has expanded its Multipacpro range of 19in chassis with the addition of a model that is suitable for applications such as audio equipment and test-and-measurement instrumentation.

The chassis provides a lightweight, sturdy housing for either PCBs or non-standard components.

It features high-stability side profiles and is available in 1U, 2U, 3U, 4U and 5U heights, with external dimensions in accordance with IEC 60297-3-100, -101 and -105.

Top covers and base plates can be specified as plain, perforated or with machined holes for mounting EN 60603 (DIN 41612) connectors or insulated backplanes.

The rear panel is detachable to allow easy machining.

In addition, Schroff’s Serviceplus modification service enables the chassis to be customised to suit individual requirements for drilling, cut-outs and screen printing.

The standard chassis achieves an EMC shielding level of 30dB(A) at 1GHz, while for higher-performance applications, an EMC gasketing kit is available.

Other optional accessories include front handles, guide rails and telescopic slides.

The Multipacpro chassis can be supplied in kit form from stock or fully assembled by technicians in seven working days.

With modifications, fully assembled units can be despatched in 10 working days.

For over four decades Schroff has been a world leader in the development and manufacture of electronics packaging components and systems.

The company offers a comprehensive range of enclosure solutions, including cabinets, subracks, cases, backplanes and power supplies, as well as complete systems for standard bus architectures such as VME, cPCI, AdvancedTCA and MicroTCA.

These products are based on the know-how of specialists in the integration of mechanical, electronic and thermal management systems, together with many years’ experience of the most diverse applications in all kinds of environments. Schroff technical personnel are also heavily involved in the development of international standards for electronics packaging systems, with representatives on numerous working groups of institutions such as the IEC, CENELEC, IEEE, BSI, VDE and DIN.

To complement its wide range of products, the company has established a co-ordinated service strategy designed to ensure that customers enjoy comprehensive support throughout the life of the product.Grouped together under the banner ‘ServicePLUS’, Schroff’s product support services are now arranged in eight modules comprising configuration, assembly, modification, solution, express, support, academy and lifecycle.

The Schroff website, provides full technical information on all of the company’s products, including detailed descriptions, technical data, user manuals, test reports and downloadable CAD drawings

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