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Seica will be featuring its developments in printed board design and manufacturing, electronics assembly and test, such as the Firefly Selective Soldering System, at SMT Nuremberg.

The system uses lead-free solder and its board and components are soldered correctly, without undesirable thermal stress.

Laser technology allows a non-contact soldering process, while the accuracy of the thermal process ensures high quality of solder joints.

There is a high level of process flexibility in all applications and the system can solder a range of components, including through-hole components, pin-grid array, odd-form components, RF shielding and connectors.

The Pilot V8 flying probe test technology is designed as a complete solution for those who want high test speed, low to medium volume, test coverage and flexibility for prototyping, manufacturing, or repairing any type of board.

Seica will demonstrate the latest updates on Pilot V8 on video at SMT.

With eight electrical flying test probes, two Openfix flying probes, two power flying probes and two CCD cameras (one on each side), the Pilot V8 has 14 mobile resources available to test the UUT, all included in a vertical, compact and robust architecture.

The system also includes statistic functions and procedures of the retest of the failures.

Seica, in partnership with Temento Systems, has developed the Flyscan module as a new approach to the integration of the boundary-scan technique and flying probe-test systems.

Flyscan is available on the complete line of Pilot/Aerial flying probe testers and is fully integrated at the core system level.

Flyscan enables: automatic generation of the test program in a single software environment (Seica VIVA); automatic creation of the boundary scan program using the extended test function and the flying probes to transform them into JTAG testable nets; automatic elimination of test redundancies; automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component; a single test report in the VIVA environment; and anagement of the faults detected by the boundary scan test in the Seica Repair Station environment.

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