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FLIR Systems has published a new technical note that investigates and describes how to use low-cost materials to increase target emissivity to enable accurate measurement using a thermal imaging camera.

Clean, unoxidised, bare metal surfaces such as are found in many R&D applications have low emissivity. Consequently they are difficult to analyse with a thermal imaging camera. To get good accurate temperature measurements there is a consequent need to increase the emissivity of these problematic targets.

The technical note provides an informative introduction to emissivity and how a target’s emissivity, reflectance and thermal conductivity values are highly dependent on material properties. The authors describe several cost-effective techniques to compensate for low emissivity based upon reducing the reflectance of the target enabling a significant improvement in measurement accuracy. Further a simple technique to facilitate fault finding on populated printed circuit boards (PCB) containing a variety of metal and plastic components using a thermal imaging camera is described.

Technical note: How to use low-cost materials to increase target emissivity to enable accurate measurement using a thermal imaging camera

FLIR Systems has published a new technical note that investigates and describes how to use low-cost materials to increase target emissivity to enable accurate measurement using a thermal imaging camera.

Clean, unoxidised, bare metal surfaces such as are found in many R&D applications have low emissivity. Consequently they are difficult to analyse with a thermal imaging camera. To get good accurate temperature measurements there is a consequent need to increase the emissivity of these problematic targets.

The technical note provides an informative introduction to emissivity and how a target’s emissivity, reflectance and thermal conductivity values are highly dependent on material properties. The authors describe several cost-effective techniques to compensate for low emissivity based upon reducing the reflectance of the target enabling a significant improvement in measurement accuracy. Further a simple technique to facilitate fault finding on populated printed circuit boards (PCB) containing a variety of metal and plastic components using a thermal imaging camera is described.

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