Product Details Supplier Info More products

Intertronics’ ACC AS1803 single-part thermal-transfer silicone adhesive has a thermal conductivity of 1.55W/mK and is used for electronics applications in aerospace, under-bonnet automotive, consumer products and LED applications.

Because of its neutral cure and the absence of any harmful byproducts, ACC AS1803 can be used as a replacement for conventional oxime-based silicone adhesives.

Thermally conductive silicones such as ACC Q-Sil 553 are said to be effective in a thermal-transfer role in the manufacture of power supplies, under-bonnet electronics and LED packaging.

They can be used to bond components to heat sinks without the need for mechanical fixing while eliminating the development of air gaps that would reduce performance.

This approach has been used to coat the back of large-scale LED displays, offering environmental protection and effectively removing heat from the diodes.

Key specifications

  • Enhanced natural silicon properties
  • Optimised for applications in thermal management
  • Eliminate corrosive action when in contact with sensitive metals
  • Enables heat to be removed from a number of components within a single device
  • Non-setting compounds or ‘grease’ do not set but offer heat-dissipation capability, plus a facility for easy rework or repair

Thermal-transfer silicone adhesive can be used in electronics applications in aerospace

Intertronics’ ACC AS1803 single-part thermal-transfer silicone adhesive has a thermal conductivity of 1.55W/mK and is used for electronics applications in aerospace, under-bonnet automotive, consumer products and LED applications.

Because of its neutral cure and the absence of any harmful byproducts, ACC AS1803 can be used as a replacement for conventional oxime-based silicone adhesives.

Thermally conductive silicones such as ACC Q-Sil 553 are said to be effective in a thermal-transfer role in the manufacture of power supplies, under-bonnet electronics and LED packaging.

They can be used to bond components to heat sinks without the need for mechanical fixing while eliminating the development of air gaps that would reduce performance.

This approach has been used to coat the back of large-scale LED displays, offering environmental protection and effectively removing heat from the diodes.

Key specifications

  • Enhanced natural silicon properties
  • Optimised for applications in thermal management
  • Eliminate corrosive action when in contact with sensitive metals
  • Enables heat to be removed from a number of components within a single device
  • Non-setting compounds or ‘grease’ do not set but offer heat-dissipation capability, plus a facility for easy rework or repair

View full profile