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TTI has announced Tyco Electronics’ Z-Pack Slim UHD (ultra-high density) connector series for telecommunication, router, server or switch applications.

Devices are available in a standard version for data transfer rate of up to 3.5Gbps and a high-speed version that offers up to 20Gbps and above.

The pin assignments of the components can be adjusted to meet future demands.

The cost-effective connector interface is designed to support the increasing demands for higher signal density in small system slot pitches.

The Z-Pack Slim UHD connector system is flexible and upgradable and fits in 15mm system slot pitch applications and above.

The connector features a high contact density (55 pins/cm2) combined with good signal performance.

Flexibility is achieved by giving the board designer the ability to implement pin assignments in such a way that they fulfil the application signal requirements for today or for a later point in the application’s project life.

A 2.0 differential pair per column assignment, for example, results in 24 differential pairs per connector module.

If signal speeds of more than 20Gbps are specified, a 1.5 differential pair per column assignment can be selected.

Two different performance versions of the receptacle connector can make an application upgradable, simply by exchanging daughter cards.

The Common Speed (CS) version can be used for signal speeds up to about 3.5Gbps, while the High Speed (HS) version is capable of operating at more than 20Gpbs.

Both receptacle versions have identical envelope dimensions and mate with a uniform header connector.

In this way, customers do not have to buy an expensive, high-speed connector if the application does not initially require high-speed signalling during an early phase development.

Later, when signal speeds need to increase, daughter cards can be exchanged with ones equipped with high-speed connectors, but the backplane does not require any changes.

The low profile and high density allows designers to reduce the board spacing between adjacent daughter cards in a rack, making room for more cards or reducing the size of the application.

Z-Pack Slim UHD connectors can also assist in thermal management within the system by creating less obstruction to cooling airflow.

The over-moulded signal contacts on the receptacle, in combination with the plastic ribs embedded in the header design, result in a reliable and protected interconnect solution.

The product family consists of a right-angle receptacle, vertical header and guiding modules.

In addition to that, the Z-Pack Slim UHD connector series has been completed with a right-angle header (coplanar) and power modules.

About TTI, Inc.

TTI’s philosophy is “Lead by Design”, and the company differentiates itself by focusing on people, parts and process. TTI, Inc. is a specialty distributor of passive, interconnect, relay & switch and discrete components. The company has developed a policy in Europe of being the distributor of choice for customers and suppliers alike by introducing new product technologies from key supply partners to its customers – and by stocking broad and deep across its franchise base.  TTI also operates sophisticated inventory management processes which ensure that it has the ability to service changes in component demand due to fluctuating markets and supply chains.

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