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Unisem Advanced Technologies (UAT) has announced that it has developed a methodology for creating a stress buffer to protect delicate features of semiconductor devices.

The customisable stress buffer structure includes a polymer layer formed by one or multiple coatings, and a metal stack overlaying the polymer.

The structure serves as a bunker to protect sensitive devices within its coverage from external stress.

UAT said its use may extend beyond stress mitigation, including shielding of sensitive devices from lights, moisture and electromagnetic interferences.

The company added that its manufacturing capabilities for patterning fine dimension features are suited for creating unique patterns of stress buffer structure for each device.

UAT has a patent pending on this process.

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