Product Details Supplier Info More products

AGY has introduced ultra-fine yarns for use in printed circuit board (PCB) substrates.

These ultra-fine yarns allow PCB suppliers to create thinner laminates for higher layer counts and greater circuit density.

‘What makes them ultra-fine is the small number of fine-diameter filaments comprising the yarn,’ said Scott Northrup, director of new business development at AGY.

‘For example, our C1200 yarn, which is used to produce fabric style 1037, consists of 100 filaments of 4.5 micron diameter.

‘Our BC 1500 yarn, used to produce fabric style 1027, consists of 100 filaments of four-micron diameter.

‘Our BC 3000 yarn, currently under development, will contain only 50 filaments of four-micron diameter.

‘For comparison, until the introduction of ultra-fine yarns, the finest yarns for PCBs have been five micron, typically with 100 or 200 filaments – known as D900 and D450.

‘Other common yarns used in PCBs consist of 200 or 400 filaments of seven or nine-micron diameter,’ added Northrup.

Used as a reinforcement and dielectric, the ultra-fine yarn is woven into fabric and then laminated with epoxy resin and copper foil to produce copper-clad laminate – the building block of PCBs.

‘The yarn’s E-Glass composition makes it an excellent electrical insulator and provides thermo-mechanical stability to the PCBs.

‘Reinforcement with glass-fibre fabrics results in excellent dimensional stability, which means the board will not warp and twist under stress and heat,’ Northrup continued.

Ultra-fine yarn is particularly well suited for rigid-flex PCBs.

This new technology has emerged to meet the ever-increasing need to maximise available space within the electronic assembly.

‘It allows designers to “fit the circuitry to the device” rather than fit the device to the circuitry,’ explained Northrup.

‘The fine diameter of our ultra-fine yarns is conducive to very thin circuits that may involve some degree of flexing or bending.

‘Another emerging market for ultra-fine yarn is mobile communications base stations that require very high layer-count boards and a high degree of functionality in a given space,’ he finished.

View full profile