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VIA Technologies has announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000.

The VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies.

Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

The VIA AMOS-5000 is available now and targets a wide variety of embedded segments including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.

The VIA AMOS-5000 chassis kit makes it easy to assemble robust systems that can withstand a wide temperature range of -20C to 55C, capable of sustaining a g-force of up to 50.

VIA AMOS-5000 chassis uses only five mechanical separate parts to form a robust, fanless system with extensive I/O options.

A range of configurations are supported through optional side panels that support a variety of forthcoming Em-ITX I/O expansion modules.

These modules include custom designs as well as standard VIA-developed designs.

Advanced digital signage applications can add dedicated graphics processing and the latest display connectivity, while network focused applications can add supplementary Wi-Fi and bluetooth support.

The VIA AMOS-5000 chassis combines with the integrated heatsink design found on Em-ITX boards.

The discrete aluminum heatsink has direct contact with the processor and chipset on reverse side of the board, forming a solid, robust base for chassis assembly.

An optional storage compartment can also be added.

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