TSMC joins semiconductor manufacturing programme

Taiwan Semiconductor Manufacturing Company (TSMC) has joined the ASML Holding Customer Co-Investment Program, which is aimed at accelerating the development and industrialisation of key next-generation semiconductor manufacturing technologies.

These include extreme ultraviolet (EUV) lithography technology and 450mm lithography tools.

The agreement includes an investment amount of €838m (£663m) in Netherlands-based ASML to acquire five per cent of its equity and to commit €276m, spread over five years, to ASML’s research and development programmes.