over the Internet.
3DSP have introduced what the company claims is the industry’s first online Assisted Design Environment (ADE ) allowing the design of digital signal processing (DSP) system-on-a-chip (SoC)over the Internet.
Called HiFI (for highly flexible, integrated), the new design environment isavailable at www.3dsp.com.
As its name suggests, HiFI is an integrated Web-based design environment where engineers can customise high-performance, configurable DSP cores, choose from an array of instruction-set options, add new application-specific instructions, add or delete functional units, and configure register file size.
HiFI provides templatised environments with a large number of customisable access points.The engineer defines the SoC specification, then defines the hardware and software requirements using online design tools available through HiFI. A cycle-accurate C-simulator of the custom SoC design, an assembler/linker and a C-compiler for the configured DSP core, plus estimates of SoC die size and performance are provided via the Internet.
HiFI outputs can be used to determine if the design meets product requirements. When the design is finalised, RTL (registered transfer level) code ready for synthesis is generated and sent to the customer. In addition, a test bench, synthesis scripts and timing constraints are provided.
Phase II HiFI capabilities will include an option to take the design all the way to netlist. The finished design can be manufactured at any Wafer Fab in the world.
Prior to generation of the RTL, the customer company pays only a modest fee for use of HiFI. Not until the spec is met and the design is finalised does the customer enter into a licensing agreement with 3DSP.
Additional services such as project management, test tooling and design consulting are available to the customer at an additional cost.
For more information on the company visit www.3dsp.com or contact 3DSP at 16735 Von Karman, Suite 100, Irvine, CA 92614; phone: (949) 260-0156; Fax: (949) 260-0151.