InterDigital Communications and Infineon are expanding their development and marketing agreement to include the joint development of HSDPA (High Speed Downlink Packet Access) 3G protocol stack software technology for Infineon’s 3G platform.
HSDPA is a packet-based data service for 3G mobile networks supporting peak data transmission rates of 14 Mbps.
Since March 2001, InterDigital and Infineon have been developing and commercialising 3G technologies and products in a strategic relationship.
Under the expanded agreement, InterDigital and Infineon will continue to jointly develop and upgrade the 3G protocol stack incorporating UMTS Release 5 and HSDPA. InterDigital will be compensated for associated non-recurring engineering services.
InterDigital and Infineon also amended the royalty structure established in the original 2001 co-operative agreement. The new royalty rate structure extends the term and amends the per-unit royalty rates to be paid to InterDigital for the sale of Infineon’s ASICs containing jointly developed software.