$50 million pad plant

Rohm and Haas Electronic Materials, CMP Technologies has announced plans to build a $50 million pad manufacturing plant and technology centre at the Chunan Science Park, Taiwan.

, which engages in chemical mechanical planarisation (CMP) technology for the global semiconductor industry, will build a pad manufacturing plant and technology centre at the

, a satellite campus of the

in

.

The Rohm and Haas Electronic Materials, CMP Technologies Asia Pacific Manufacturing and Technical Centre will encompass next-generation IC1000 polishing pad production, an applications lab and sales and customer support offices.

Expected to be in commercial production by the first quarter of 2007, the centre’s proximity to fabs throughout Asia will enable faster response times and local support for existing customers and new 300mm fabs being built over the next decade.

Rohm and Haas Electronic Materials will invest $50 million in this manufacturing and technology centre located on six acres in the Chunan Science Park. This facility can be expanded to accommodate future growth in the Asia Pacific region, which currently accounts for more than 65 percent of the business of CMP Technologies.

Register now to continue reading

Thanks for visiting The Engineer. You’ve now reached your monthly limit of news stories. Register for free to unlock unlimited access to all of our news coverage, as well as premium content including opinion, in-depth features and special reports.  

Benefits of registering

  • In-depth insights and coverage of key emerging trends

  • Unrestricted access to special reports throughout the year

  • Daily technology news delivered straight to your inbox