Adhesion solution plugs holes in separation technologies

Conventional thermal-based separation technologies require heat to drive the separation processes and this energy consumption can account for between 40-70 per cent of the total capital and operational cost of a chemical plant.

Separation technologies that use mixed-matrix membranes (MMMs) containing metal-organic framework (MOF) fillers do not require heat and consume up to 90 per cent less energy than distillation, resulting in a more efficient separation process plus energy and cost savings.

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This process has drawbacks as the lack of interfacial adhesion between the polymer matrix and the MOF filler causes nanosized gaps. This creates defects and voids on the membrane’s surface, which can diminish the selectivity of the MMM.

Inspired by nature, Gyorgy Szekely and Rifan Hardian from KAUST in Saudi Arabia, working with scientists from Manchester University, Hokkaido University and the Japan Science and Technology Agency, said they have overcome interfacial adhesion problems by fabricating MOF nanoparticle fillers that are more compatible with the MMM’s polymer matrix. According to the team, this eliminates the formation of pinholes at the filler–matrix interface, which improves the performance of the membranes. Their results are detailed in the Journal of Materials Chemistry A.