DTI backs hot research

led by the UK Department of Trade and Industry (DTI) is supporting an initiative to develop high temperature electronics packaging solutions for down-well and aero engine applications.

Electronic power and control systems in high temperature environments improve the accuracy of critical measurements and reduce the cost of cabling from remote and hostile locations. Typical environments include down-hole petroleum/gas/geothermal applications as well as turbine engines for aircraft propulsion and power generation.

This requirement has posed a challenge to the traditional limit of 125^oC for high temperature exposure of electronics systems. Operating temperatures above 200^oC - which are typical of these types of application - in combination with high pressures, vibrations and potentially corrosive environments mean that different semiconductors, passive components, circuit boards and assembly processes will be needed to fulfil the target performance specifications.

In order to address this challenge, the UPTEMP project has been formed with support from a £192,000 grant from the Technology Programme.