Keep cool

Enclosures manufacturers are facing increasing problems with heat dissipation that call for innovative solutions.

As computers become faster and more powerful, increasing temperatures can dramatically shorten the working life of components. In the long term, heat generated from compact server rack systems can no longer be kept under control using standard air-cooling. This is why the fastest processors available have not been installed in compact servers until now.

One solution is the Liquid Cooling Package (LCP) from Rittal. LCP is a climate-controlled package fitted to the side panel of the server rack to solve the problem of high heat losses by providing scalable cooling using air/water heat exchangers.

Key advantages for the user include even distribution of cold air, unrestricted accessibility, plus the investment safeguards of a scalable system.

When cooling air is routed through an enclosure, the devices on the uppermost levels often lose out.

This problem is avoided by the LCP package which is installed to replace the side panel of an enclosure, or alternatively one side panel each of two adjacent enclosures. It accommodates, without restricting later expansion, one, two or three air-water heat exchangers, each with a cooling capacity of 4–8kW (and an air-flow rate of 700cu metres/hour).