Mobile alliance

and

announced recently that they are expanding their strategic relationship to include 3G, WiMAX and OMAP technologies in the design and development of new mobile devices.

The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from Motorola and TI.

As part of the expansion, Motorola is developing 3G handsets based on a TI customised 3G solution that will include processors from TI's OMAP 3 architecture, as well as 3G and 3.5G building blocks from Motorola and TI. New handsets using this solution are expected to be available to consumers by 2008.

Additionally, TI is supporting Motorola's mobile WiMAX initiative, including development of a customised Motorola WiMAX solution, and providing digital design elements, high-performance analogue components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.