Project set to design new materials for advanced chip manufacturing

News

Indium-based materials are to be designed and tested in a project to enable the manufacture of next generation of computer chips.

The UTD researchers have received a $1.9m, three-year grant to support their work
The UTD researchers have received a $1.9m, three-year grant to support their work - AdobeStock

Three University of Texas at Dallas (UTD) faculty members and collaborators from other universities and two industry partners are part of the effort.

The UTD researchers have received a $1.9m, three-year grant to support their work through the US National Science Foundation Future of Semiconductors (FuSe2) program.

The UTD funding is part of $42.4m in FuSe2 grants announced in September 2024 to support the goals of the federal CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act of 2022.

By introducing indium-based materials, the researchers aim to facilitate patterning in the extreme ultraviolet (EUV) range using lithography, a key step in the semiconductor fabrication process where patterns are created on the surface of a wafer to serve as pathways for transistors and other components. According to the team, moving from deep UV to EUV range makes it possible to produce smaller, more precise features on chips for better performance and energy efficiency.

Register now to continue reading

Thanks for visiting The Engineer. You’ve now reached your monthly limit of news stories. Register for free to unlock unlimited access to all of our news coverage, as well as premium content including opinion, in-depth features and special reports.  

Benefits of registering

  • In-depth insights and coverage of key emerging trends

  • Unrestricted access to special reports throughout the year

  • Daily technology news delivered straight to your inbox

Register
Or continue by

Signing in with your registered email address