Scottish semiconductor production gets £9m upgrade

Packaging is a key stage in semiconductor manufacturing that protects chips’ core components and prepares them for use. Said to be the first of its kind in Europe, the £9m facility will enable faster production of semiconductor chips, reducing packaging times for UK firms ‘from months to just days’. It’s claimed the scale-up packaging line will support UK companies in developing new solutions and expand the use of UK-manufactured wafers while addressing critical global production gaps.

“Working closely with the Compound Semiconductor Applications (CSA) Catapult, our focus is on highly specialised packaging, using our established engineering expertise to stay ahead of rising demand,” said Professor Matt Boyle, director of electrification at NMIS. 

“Facilities and equipment for packaging have until now been the missing piece of the puzzle, and the new packaging line unlocks the potential to reshore manufacturing to the UK.

“This is just the beginning – our aim is to accelerate semiconductor manufacturing, allowing companies to explore new technologies and implement testing without disrupting day-to-day production.”