UVTP for dielectric films

has introduced SOLA, the industry's first standalone ultraviolet thermal processing (UVTP) system targeted at the post-deposition processing of advanced dielectric films.

Designed for high-volume manufacturing at 300mm, SOLA reportedly addresses the requirements for new materials and manufacturing technologies necessitated by the next generation of consumer electronic products.

Novellus claims that SOLA is a key enabler for a variety of advanced film applications, including transistor-level high-stress nitrides (HSN) and interconnect-level dense or porous low-k dielectrics.

Using a combination of UV light and heat, SOLA makes post-deposition treatment of these films possible at lower temperatures, a necessity when integrating with new materials such as nickel silicide.

Wafers with a previously deposited plasma-enhanced chemical vapour deposition (PECVD) film are introduced into SOLA, where they are exposed to a uniform UV lamp source to modify the film properties. At the same time, the wafer is heated to a uniform temperature, typically 450 C or less.

With HSN films, SOLA's UV radiation promotes bond rearrangement and volume contraction to generate the higher stress levels required to enhance device performance. With porous low-k films, UV radiation facilitates removal of porogen, and mechanically strengthens the dielectric film for further processing.