Vishay adapts converter

today announced that it is making all of its FunctionPAK dc-to-dc converters and current control modules available in a new surface-mount adaptor board configuration to support engineering prototype assembly.

While most production operations can handle the standard FunctionPAK surface-mount BGA configuration, the new SM versions of the FunctionPAK devices will facilitate the assembly process for any engineering lab that finds it difficult to handle the BGA configuration in its prototype assembly lab.

The surface-mount adaptor board is modelled on the BGA package, but the device’s contacts have been modified to extend out from under the package to scalloped castellations around the edges of the adaptor board. Either a reflow solder connection or hand soldering can be used.

The SM versions are the second of two FunctionPAK options expressly intended to streamline the design prototype process. Also available is a PI series of plug-in versions of all devices in the FunctionPAK family, which can be plugged into a ‘bread board’ for prototyping and testing. The PI series devices offer a 0.1-in. grid pin configuration for soldering directly into the circuit board and a standard socket for the added flexibility of switching different modules in and out of the circuit.