Chemical mechanical planarization is a critical production step during microcircuit manufacturing. The smaller the electronic components, the more sophisticated the CMP process. The customer goal is to have flat, smooth, polished wafers.
The polishing procedure is performed in clean room where the air contains less than one dust particle per cubic meter. Slurry containing mainly pure water, a chemical reagent and different polishing particles are used between the polishing pad and the wafer. A slurry's "health" depends on its stability and contamination level. Foreign particles, solved carbon dioxide and ionic contaminations can disturb the polishing process as well as slurry particle aggregates and agglomerates. A dynamic measurement of the slurry properties coupled with defined control limits can be used to determine a slurry health.
Download the application report to understand how the Anton Paar L-Dens 7400 density sensor provides real-time data to indicate slurry health.
Project to investigate hybrid approach to titanium manufacturing
What is this a hybrid of? Superplastic forming tends to be performed slowly as otherwise the behaviour is the hot creep that typifies hot...