Lausanne, Switzerland-based Synova has entered into a partnership with Munich-based Disco Hi-Tec Europe to combine Synova’s Laser MicroJet technology with Disco’s blade-saw dicing systems to develop a hybrid dicing tool for advanced dicing applications.
The resulting solution will enable semiconductor manufacturers to meet their dual need for higher throughput and minimal damage on silicon wafers.
The insatiable demand for smaller, more feature-packed consumer products has posed new challenges to IC manufacturers, who now must squeeze more functionality into ever-smaller packages. One of the major challenges facing the packaging industry in this regard is that chipmakers’ new wafer materials are brittle and damage-prone when undergoing traditional dicing technology.
The new partnership aims to join DISCO’s blade saw and Synova’s Laser MicroJet technology, giving manufacturers a dicing solution for both current and next-generation ICs that cost effectively meets their stringent yield and throughput requirements.
Company officials report that the first tools are slated for introduction in late 2007. Both companies will contribute to the manufacturing of the resulting hybrid tool, and will share marketing and sales efforts.