FBAR sensor improves production of 3D camera chips

Sorex Sensors develops new FBAR sensor for use in the production process of 3D camera chips, which is 1000 times more accurate than existing sensors.

Facial recognition software is increasingly being used on smartphones such as the iPhone X for security and payment purposes.

The technology, which is based on a 3D camera chip known as an infra-red vertical cavity surface emitting laser (VCSEL), is expected to be used on one billion smartphones within the next two years.

However, the technique typically used to produce these cameras is inaccurate, resulting in around 50 per cent of the chips being discarded. This significantly adds to their cost.

Now Sorex Sensors, a spin-out from Cambridge University, has developed a new sensor for use in the production process, which it claims is 1000 times more accurate than existing sensors.

The FBAR (Film Bulk Acoustic Resonator) sensor, which will be launched this autumn, can help to improve the production process, significantly improving yields, according to CEO Michael LeGoff.

“Manufacturers are currently throwing half their material away, so if they can find a way to improve their yield, the economics are compelling,” he said.

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