Nanusens' technique builds sensor structures within chips

Micro Electro Mechanical Systems (MEMS) are a vital component in most electronic devices, as they provide the sensing capabilities that make the technology smart.

However, since every MEMS sensor design is unique, each needs its own specially-developed manufacturing process, making it difficult to quickly ramp up to large volume production.

Now London-based Nanusens has developed a technique to use the same standard production process used to make electronic chips, known as the Complementary Metal Oxide Semiconductor (CMOS) process, to build MEMs sensors.

In this way, the devices can be produced in any fabrication plant, in large volumes, according to Dr Josep Montanyà, CEO of Nanusens.

In the CMOS process, silicon dioxide is etched away to produce the mechanical structure. In the new MEMS process, these structures can include nanoscale moving parts such as springs, which form the sensor.

“You need empty space to allow the movement [of the MEMS device],” said Montanyà. “So we etch away the silicon dioxide very quickly, and leave the metal. In this way we generate the empty spaces we need in order to allow the metal to move,” he said.