Heat absorbing microcapsules could enable smaller electronic devices

Dr Goran Vladisavljevic, of Loughborough University, and a team of researchers have designed and manufactured microcapsules filled with phase change materials (PCMs) that absorb heat by turning from a solid to a liquid at elevated temperatures.

The capsules – which are around 0.2mm wide and do not require an energy source – could be used to absorb heat that would otherwise be transferred to elements in electronic devices.

They can be reused indefinitely without losing their effectiveness because once temperatures drop, they solidify and reset.

In a statement, Dr Vladisavljevic said: “The microcapsules rely on a natural phenomenon of melting and crystallisation caused when the ambient temperature is above or below the melting temperature of the phase change material,”

“Suppose that overheating occurs above 80°C. Once the temperature in a device exceeds 80°C, heat energy will be absorbed by the capsules as the phase change material transitions from solid to liquid.

“When the temperature is reduced below 80°C, the stored energy will be released slowly as the phase change material starts to solidify.