Qinetiq tests RFID’s mettle

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have launched a joint development programme to adapt Qinetiq’s Omni-ID Pak integrated Radio Frequency Identification (RFID) technology for use on metal packaging. This would enable suppliers to integrate ultra high frequency (UHF) RFID tags into metal packaging for a wide variety of applications at the single item level.

The technology is designed to mitigate issues such as signal reflection, detuning and grounding which reduce or negate RFID’s effectiveness on metal packaging or with water-based products. It uses several of metal’s inherent properties that would usually be problematic and uses them to its advantage.

Qinetiq’s standalone Omni-ID Tag and integrated Omni-ID Pak technology allow a UHF tag to be mounted directly onto the metal substrate. Measuring less than 1mm in thickness, the Omni-ID structure collects and focuses RF energy and enables highly efficient coupling to the chip. Another advantage of the system is that RFID chips require only a short coupling antenna rather than the large dipole usually incorporated in UHF tags, significantly reducing manufacturing costs.