The new technique is said to be particularly applicable to devices that generate a lot of heat, such as lasers and power devices.
According to a statement, the technique uses a so-called ‘heat spreader’ made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film.
‘Both the copper-graphene and indium-graphene have higher thermal conductivity, allowing the device to cool efficiently,’ said Dr Jag Kasichainula, an associate professor of materials science and engineering at NC State and author of a paper on the research.
Kasichainula found that the copper-graphene film’s thermal conductivity allows it to cool approximately 25 per cent faster than pure copper, which is what most devices currently use.
Dissipating heat from electronic devices is important, because the devices become unreliable when they become too hot.
The paper lays out the manufacturing process for creating the copper-graphene composite, using an electrochemical deposition process.
‘The copper-graphene composite is also low cost and easy to produce,’ said Kasichainula. ‘Copper is expensive, so replacing some of the copper with graphene actually lowers the overall cost.’
The paper, entitled ‘Thermal Conductivity of Copper-Graphene Composite Films Synthesized by Electrochemical Deposition with Exfoliated Graphene Platelets’, is published in Metallurgical and Materials Transactions B.
UK not prepared for climate impacts, says CCC
Perhaps a Longtitude prize to solve railway line problems. "extreme heat causing further disruption through rail buckling and power line...