Techsil have launched a new epoxy-based underfiller into the UK market. Structalit® 8202 is a low viscosity one-part adhesive with a high capillary flow filling the narrowest gaps.
Structalit® 8202 is a high performance underfill material designed for chip stack packages and BGAs. It is a one part, black coloured epoxy with low viscosity which flows into the narrowest of gaps. Special features of this product include its low coefficient of thermal expansion and high glass transition temperature. This makes Structalit® 8202 stable at high temperatures, allowing usage in reflow processes.
Structalit® 8202 cures rapidly under the influence of heat. The underfiller can also be cured during reflow processes. Due to its very good compatibility with most lead free solders the adhesive cures completely even if it gets into contact with residues from flux agents.
Once cured, the material provides excellent mechanical properties to protect solder joints during thermal cycling. Structalit® 8202 is RoHS compliant and meets electronic grade standards (less than 900ppm Cl-) and was developed by German adhesive manufacturers, Panacol.
For more information contact technical@techsil.co.uk
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